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    About Us

Company Profile

Motorcomm Electronic Technology Co., Ltd. ("Motorcomm"), founded in 2017, has set up R&D centers in Suzhou High-tech Zone and Shanghai Zhangjiang Science City, and companies in Shanghai, Chengdu and Shenzhen, aiming at realizing the industrialization of full coverage services. Adhering to the culture of "Efficiency First, Pursuit of Excellence", Motorcomm focuses on the R&D, design and sale of high-speed wired communication chips.Motorcomm has been implementing the "market-oriented and technology-driven" development strategy, and aims to offer the market high-reliability and high-stability communication chip products. We're taking the Ethernet Physical Layer (PHY) chip as the approach to the market, and continue to unveil series of chip products. Motorcomm is one of the few suppliers of Ethernet PHY chips with independent intellectual property rights and volume sales in the Chinese Mainland. Motorcomm will focus on enhancing our capability to innovate, research and develop core technologies, continuously enhancing the competitive advantages of our Ethernet series products in the market, and finding our correct location in the era of technological innovation.

Nanjing
Nanjing
Shanghai
Motorcomm Eastern Branch
Shanghai R&D Center
Chengdu
Motorcomm Southwest Branch
Shenzhen
Motorcomm Southern Branch
Suzhou
Motorcomm Headquarters
Suzhou Development Center
Singapore
Motorcomm Development Center
branch
R&D center
Development Center

Drawing review #: GS(2016)1663

Supervised by the Ministry of Natural Resources of the People's Republic of China

Development Paths

  • 2017

    Start-up
    Company founded.
    First 100BASE-T1 PHY Taped Out.

  • 2018

    Warm-up
    The first chip was successfully developed
    Started to develop the frist generation of FE PHY and GE PHY

  • 2019

    Rise-up
    MP of FE PHY and GE PHY;
    Started the development of Multi-ports GE PHY;

  • 2020

    Breakthrough
    MP of Multi-ports GE PHY
    Automotive 100BASE-T1 PHY passed C&S IOP and AEC Q100 test

  • 2021

    Scale Expansion
    ISO26262 qualified
    A significant increase of the annual revenue

  • 2022

    Tech Innovation
    IPO application was successfully approved
    Expanded another 2 product lines: NIC and Switch Opened its first overseas office in Singapore

  • 2023

    Go Public
    IPO was successfully completed
    Kicked off the projects of TSN Switch and SerDes for Automotive market

  • 2024

    R&D Upgrade
    Enhanced R&D strategy, set up NBU and ABU
    Product portfolio expansion and optimization

2017

2018

2019

2020

2021

2022

2023

2024

  • Certifications
  • Patents
  • ISO 9001 Certification
  • AEC-Q100 GRADE1 Qualification
  • OPEN Alliance's Interoperability Certification (C&S International Certification)
  • SGS ISO 26262:2018 (Automotive Electronic Functional Safety Certification)
  • High-tech Enterprise Certificate
  • EMC Test Report
  • specialized and sophisticated "little giant" firm
  • 132 invention patents filed (36 granted)
  • 24 utility model patents filed (20 granted)
  • 41 IC layout designs granted